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Dow Electronic Materials Announces Two New VISIONPAD(TM) Polishing Pads for Advanced IC

VISIONPAD(TM) 6000 and VISIONPAD(TM) 5200 Polishing Pads Offer Improved Overall Process Performance and Reduced Cost of Consumables Dow Electronic Materials /quotes/comstock/13*!dow/quotes/nls/dow  (DOW  25.57, -0.12, -0.47%) , a leader and innovator in chemical mechanical planarization (CMP) technology for the global semiconductor industry, today introduced its latest VISIONPAD(TM) polishing pads VISIONPAD(TM) 6000 and VISIONPAD(TM) 5200. These...read more »